Our offering

Eco-friendly, Industrial site, decades of expertise at the service of our customer

Innovation is at the heart of our processes and technologies, enabling us to achieve levels of quality and performance that meet or exceed our customers’ expectations.

Our solutions for high resolution Flexible Printed Circuits (FPC) in Reel-to-Reel format

Micro-connectors in R2R format

Single and Double-sided
Line & space<70µm
Contact: Nickel, Palladium, Scratch-resistant gold alloy
Bonding: Nickel, pure gold

High resolution antennas

Single or multilayer antennas
Interconnection with robust semiconductor vias

High precision sensors & electrodes

Electrochemical electrodes
Reference electrodes (Platinum, AgAgCl, Gold, Carbon …)
For medical, wearable and environmental sensors

Heterogeneous Integration & Flexible Mecatronic

Heterogeneous integration is a key element of innovation in microelectronics.
Today, our mastered technological building blocks enable us to develop heterogeneous integration solutions on flexible substrates, in R2R or wafer format.

Embedded die
Chip interconnection with copper
Multilayers

Our technological expertise

With 130 years of cumulative experience in Intelligent Microcircuits and mecatronic from a senior team in microelectronics, we have developed technological expertise, enriched by the talents of our teams.
EYCO excels particularly in:

Micro Mechanics
Photolitography
Surface treatment
Video inspection

Simultaneous Engineering

We support each of our customers in creating their own value, using processes and machines designed exclusively by EYCO and to which we give free access.
Every final product is the result of this co-development or simultaneous engineering process.
Confidential, secure and virtuous, we first and foremost “manufacture products to provide solutions to our clients“.

Video inspection :

automated video quality control
100% in line defective parts invalidation

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Surface treatement :

selective for precious metal
vias cuivre
electro plating metal precious & nickel
organic treatment & surface preparation

eyco-technicien-inspection-substrat-electronique

Photo-litho :

salle blanche
masques photos (dimensions, resolution)
chemical etching (dimensions, cuivre)

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Micro-mechanics :

reel-to-reel (size)
stamping (limites, mechanical & laser)
lamination (tolerence)
slitting & singulation

eyco-bobine-connecteurs-machine-bobinage

Our industrial site

EYCO is a key player in the European microelectronics industry, recognized for its expertise, innovation and ability to produce in very high volumes. Located in Trets (13), in the heart of the French Silicon Valley, our 3,700 m² site is equipped with the most advanced technologies to offer packaging solutions adapted to current and future needs.

With a production capacity of several hundred million units a year, extensions are planned to exceed one billion units.

The site is ISO9001 and ISO14001 certified.